Intel researchers have announced a number of technological innovations and concepts, including packaging improvements that could result in computer chips that are ten times as powerful as today’s most advanced silicon.
According to the company, its latest research could pave the way for chips with more than a trillion transistors by 2030, significantly expanding the concept of Moore’s Law, which states that the number of transistors on a microchip doubles every two years as chip manufacturing technology advances.
Intel announced research breakthroughs in 2D and 3D IC packaging technologies, which will fuel the company’s innovation pipeline in order to meet its promise of putting a trillion transistors on an integrated circuit (IC) by 2030. According to a company press release, the packaging technologies include a new 10x improvement in density; new materials for 2D transistor scaling beyond RibbonFET, including super-thin material only 3 atoms thick; new possibilities in energy efficiency and memory for higher-performing computing; and advancements in quantum computing.
“Seventy-five years since the invention of the transistor, innovation driving Moore’s Law continues to address the world’s exponentially increasing demand for computing.
At IEDM 2022, Intel is showcasing both the forward-thinking and concrete research advancements needed to break through current and future barriers, deliver to this insatiable demand, and keep Moore’s Law alive and well for years to come.” -Gary Patton, Intel vice president and general manager of Components Research and Design Enablement.
Intel is also paving the way for 300 mm GaN-on-silicon wafers by demonstrating a 20-fold gain over industry standard GaN and setting an industry record figure-of-merit for high-performance power delivery.
The sources for this piece include an article in TechSpotTechSpot.
